Florida Department of Education
Curriculum Framework 
Program Title:	Semiconductor Cleanroom Operator
Career Cluster:	Manufacturing 

CCC	
CIP Number	0615061601	
Program Type	College Credit Certificate (CCC)	
Standard Length	18 credit hours 	
CTSO	SkillsUSA	
SOC Code(s) 
(all applicable)	Assignment pending. 	
CTE Program Resources 	http://www.fldoe.rg/academics/career-adult-edu/career-tech-edu/program-resources.stml	

Purpose

This certificate program is part of the Semiconductor Engineering Technology AS degree program (pending).  

A College Credit Certificate consists of a program of instruction of less than sixty (60) credits of college-level courses, which is part of an AS or AAS degree program and prepares students for entry into employment (Rule 6A-14.030, F.A.C.).

This program offers a sequence of courses that provides coherent and rigorous content aligned with challenging academic standards and relevant technical knowledge and skills needed to prepare for further education and careers in the Manufacturing career cluster; provides technical skill proficiency and includes competency-based applied learning that contributes to the academic knowledge, higher-order reasoning and problem-solving skills, work attitudes, general employability skills, technical skills and occupation-specific skills and knowledge of all aspects of the Manufacturing career cluster. 

The content includes but is not limited to electrical and digital circuits, installation and programming of robotic systems and silicon and wafer fabrication to include photolithography, plasma etching and advanced packaging. 

Additional Information relevant to this Career and Technical Education (CTE) program is provided at the end of this document.

Program Structure

This program is a planned sequence of instruction consisting of 18 credit hours.

Standards

After successfully completing this program, the student will be able to perform the following:

01.0	Demonstrate proficiency in laboratory practices.
02.0	Demonstrate proficiency in electrical circuits.
03.0	Demonstrate proficiency in digital circuits.
04.0	Demonstrate an understanding of silicon and wafer fabrication.
05.0	Demonstrate safe clean room practices and policies.
06.0	Demonstrate an understanding of packaging and wafer level advanced packaging.
07.0	Demonstrate employability skills.

Florida Department of Education
Student Performance Standards

Program Title:		Semiconductor Cleanroom Operator
CIP Number:			0615061601
Program Length:		18 credit hours 
SOC Code(s):			 

This certificate program is part of the Semiconductor Engineering Technology AS degree program (pending).  At the completion of this program, the student will be able to:	
01.0	Demonstrate proficiency in laboratory practices.--The student will be able to:	
01.01	Apply Occupational Safety Health Administration (OSHA) safety standards in an electronics laboratory environment when required.	
01.02	Analyze drawings and electronic schematics to make proper electrical and component connections and to also identify obvious faulty connections.	
01.03	Identify and use electrical/electronic hand and power tools (wire stripper, wire needle-nose clipper, solder and desolder station, etc.).	
01.04	Practice electrostatic discharge (ESD) safety procedures.	
01.05	Describe various applications of automation and robotics.	
01.06	Describe the construction of printed circuit boards (PCBs).	
01.07	Use circuit simulation programs to solve problems, verify circuit functionality and design circuits.	
01.08	Demonstrate the use of instrumentation and module analytical software.	
01.09	Read and interpret data sheet specifications for electronic components.	
01.10	Identify basic limitations of multi-meters, oscilloscopes, function generators and power supplies.	
01.11	Describe maintenance procedures, specifically in a total productive maintenance (TPM) in a manufacturing setting.	
01.12	Identify different types of personal protection equipment (PPE), their requirements and where they are used.	
01.13	Know the lock-out tag-out (LOTO) regulations.	
02.0	Demonstrate proficiency in electrical circuits.--The student will be able to:	
02.01	Describe the physical laws that govern electricity and magnetism.	
02.02	Identify sources of electricity.	
02.03	Define voltage, current, resistance, power and energy.	
02.04	Apply Ohm's law and power formulas to electrical/electronic circuits.	
02.05	Read and interpret color codes and symbols to identify electrical components and values.	
02.06	Measure properties of a circuit using Digital Multi-meter (DMM) and oscilloscopes.	
02.07	Calculate and measure the conductance and resistance of conductors and insulators.	
02.08	Solve problems in electronics utilizing metric prefixes.	
02.09	Apply Ohm's law and Kirchoff's voltage and current laws to solve series, parallel and series-parallel circuits.	
02.10	Construct and verify operation of series, parallel and series-parallel circuits.	
02.11	Analyze and troubleshoot series, parallel and series-parallel circuits.	
02.12	Apply Ohm's law and Kirchoff's voltage and current laws to bridge circuits.	
02.13	Construct and verify the operation of bridge circuits.	
02.14	Analyze and troubleshoot bridge circuits.	
02.15	Identify and define voltage divider circuits (loaded and unloaded).	
02.16	Construct and verify the operation of voltage divider circuits (loaded and unloaded).	
02.17	Analyze and troubleshoot voltage divider circuits (loaded and unloaded).	
02.18	Apply maximum power transfer theory to determine the conditions under which maximum power transfer occurs in a circuit.	
02.19	Construct and verify the operation of direct current (DC) and alternating current (AC) circuits that demonstrate the maximum power transfer theory.	
02.20	Describe magnetic properties of circuits and devices.	
02.21	Define resistor-capacitor (R-C) and resistor-inductor (R-L) time constants and classify the output of differentiators and integrators.	
02.22	Setup and operate power supplies for DC and AC circuits.	
03.0	Demonstrate proficiency in digital circuits.--The student will be able to:	
03.01	Define and apply numbering systems to codes and arithmetic operations.	
03.02	Analyze and minimize logic circuits using Boolean and Karnaugh Map (K-Map) operations.	
03.03	Demonstrate proficiency in the use of logic probes for digital circuits.	
03.04	Describe the various logic families and their electrical characteristics, e.g., Transistor-Transistor Logic (TTL), Complimentary Metal-Oxide Semiconductor (CMOS), etc.	
03.05	Use pulsers/pulse generators/clock signals to drive the inputs of digital circuits.	
03.06	Use oscilloscopes to analyze and troubleshoot digital circuits.	
03.07	Use logic analyzers to analyze and troubleshoot digital circuits.	
03.08	Determine the fan-out of digital circuits based on integrated circuit (IC) limitations.	
03.09	List the various types of logic gates and their truth tables.	
03.10	Construct combinational logic circuits using IC.	
03.11	Troubleshoot combinational and sequential logic circuits.	
03.12	Identify and analyze types of flip-flops and their truth tables.	
03.13	Construct flip-flops using IC.	
03.14	Troubleshoot flip-flop circuits.	
03.15	Identify types of registers and counters.	
03.16	Construct registers and counters using flip-flops and logic gates.	
03.17	Troubleshoot registers and counters.	
03.18	Analyze, construct and troubleshoot clock and timing circuits.	
03.19	Identify, construct and troubleshoot adder/subtractor logic circuits.	
03.20	Identify, construct and troubleshoot encoders and decoders.	
03.21	Identify, construct and troubleshoot multiplexer and demultiplexer circuits.	
03.22	Identify types of memory circuits.	
03.23	Describe and examine the uses of digital-to-analog and analog-to-digital conversions.	
03.24	Construct and troubleshoot digital-to-analog and analog-to-digital circuits.	
03.25	Identify, construct, and troubleshoot digital display circuits.	
03.26	Program Programmable Logic Devices (PLD).	
04.0	Demonstrate an understanding of silicon and wafer fabrication. --The student will be able to:	
04.01	Define silicon and other semiconductor substrate materials and describe its use.	
04.02	Define and understand a transistor.	
04.03	Describe the basics of wafer fabrication.	
04.04	Define and understand Moore’s Law.	
05.0	Demonstrate safe clean room practices and policies. --The student will be able to:	
05.01	Demonstrate clean room practices to include gowning and de-gowning routines.	
05.02	Know how to read safety data sheets (SDS) and identify necessary information.	
05.03	Demonstrate proper wafer handling techniques.	
05.04	Demonstrate the need for contamination control.	
06.0	Demonstrate an understanding of packaging and wafer level advanced packaging. --The student will be able to:	
06.01	Define and describe singulation, die pick and place and wire bond.	
06.02	Define types of single die packaging.	
06.03	Define and describe advanced packaging and interposer technologies.  	
07.0	Demonstrate employability skills. --The student will be able to:	
07.01	Conduct a job search. 	
07.02	Secure information about a job. 	
07.03	Identify and create documents that may be required when applying for a job to include a professional resume. 	
07.04	Complete a job application form correctly after identifying appropriate job descriptions. 	
07.05	Demonstrate competence in job interview techniques. 	
07.06	Demonstrate knowledge of how to make appropriate decisions and judgements. 	
07.07	Demonstrate appropriate work/behavioral habits. 	
07.08	Demonstrate acceptable employee personal hygiene and health. 	
07.09	Demonstrate knowledge of the Occupational Safety and Health Standard 29CFR-1910.1200, Hazard Communication.	

Additional Information

Laboratory Activities

Laboratory investigations that include scientific inquiry, research, measurement, problem solving, emerging technologies, tools and equipment, as well as, experimental, quality, and safety procedures are an integral part of this career and technical program/course. Laboratory investigations benefit all students by developing an understanding of the complexity and ambiguity of empirical work, as well as the skills required to manage, operate, calibrate and troubleshoot equipment/tools used to make observations. Students understand measurement error; and have the skills to aggregate, interpret and present the resulting data. Equipment and supplies should be provided to enhance hands-on experiences for students.

Career and Technical Student Organization (CTSO)

SkillsUSA is the intercurricular career and technical student organization(s) providing leadership training and reinforcing specific career and technical skills. Career and Technical Student Organizations provide activities for students as an integral part of the instruction offered.

Accommodations

Federal and state legislation requires the provision of accommodations for students with disabilities to meet individual needs and ensure equal access. Postsecondary students with disabilities must self-identify, present documentation, request accommodations if needed, and develop a plan with their counselor and/or instructors. Accommodations received in postsecondary education may differ from those received in secondary education. Accommodations change the way the student is instructed. Students with disabilities may need accommodations in such areas as instructional methods and materials, assignments and assessments, time demands and schedules, learning environment, assistive technology and special communication systems. Documentation of the accommodations requested and provided should be maintained in a confidential file.

Additional Resources

For additional information regarding articulation agreements, Bright Futures Scholarships, Fine Arts/Practical Arts Credit and Equivalent Mathematics and Equally Rigorous Science Courses please refer to:
http://www.fldoe.org/academics/career-adult-edu/career-tech-edu/program-resources.stml