2014 – 2015
Florida Department of Education
Curriculum Framework 

Program Title:	Microelectronics Manufacturing Technology
Career Cluster:	Manufacturing

AS	
CIP Number	1615030303	
Program Type	College Credit	
Standard Length	68 credit hours	
CTSO	SkillsUSA	
SOC Codes (all applicable) 	17-3023 – Electrical and Electronic Engineering Technicians 
17-3024 – Electro-Mechanical Technicians 	
Targeted Occupation List	http://www.labormarketinfo.com/wec/TargetOccupationList.htm	
Perkins Technical Skill Attainment Inventory	http://www.fldoe.org/workforce/perkins/perkins_resources.asp 	
Statewide Articulation	http://www.fldoe.org/workforce/dwdframe/artic_frame.asp 	

Purpose

This program offers a sequence of courses that provides coherent and rigorous content aligned with challenging academic standards and relevant technical knowledge and skills needed to prepare for further education and careers in the manufacturing career cluster; provides technical skill proficiency, and includes competency-based applied learning that contributes to the academic knowledge, higher-order reasoning and problem-solving skills, work attitudes, general employability skills, technical skills, and occupation-specific skills, and knowledge of all aspects of the manufacturing career cluster. 

The content includes but is not limited to communication skills, leadership skills, human relations and employability skills, safe and efficient work practices, and a combination of theory and laboratory activities to gain the necessary cognitive and manipulative skills to perform preventive and corrective maintenance, engineering support, and maintain product quality.

Additional Information relevant to this Career and Technical Education (CTE) program is provided at the end of this document.

Program Structure

This program is a planned sequence of instruction consisting of sixty-eight credit hours. 

Standards

After successfully completing this program, the student will be able to perform the following:

01.0	Demonstrate technical communication skills.
02.0	Demonstrate basic mathematics skills.
03.0	Use basic computer systems and applications.
04.0	Demonstrate a basic understanding of DC electronics and electronics components.
05.0	Demonstrate a basic understanding and applications of instrumentation and controls.
06.0	Follow safe clean room practices and policies.
07.0	Demonstrate an understanding of metrology testing and applications.
08.0	Demonstrate a basic understanding of vacuum and pneumatic systems and their applications.
09.0	Demonstrate a basic understanding of robotic systems and their applications.
10.0	Demonstrate an understanding of microelectonic manufacturing processes.
11.0	Demonstrate a basic understanding of quality concepts and systems.
12.0	Demonstrate a basic knowledge of chemistry and physics concepts.
13.0	Demonstrate an understanding of statistical process control.
14.0	Demonstrate an understanding of material handling and delivery.

2014 – 2015
Florida Department of Education
Student Performance Standards

Program Title:	Microelectronics Manufacturing Technology
CIP Numbers:	1615030303
Program Length:	68 credit hours
SOC Code(s):	17-3023, 17-3024

The AS degree requires the inclusion of a minimum of 15 credits of general education coursework according to SACS, and it must be transferable according to Rule 6A-14.030 (2), F.A.C.  At the completion of this program, the student will be able to:	
01.0	Demonstrate technical communication skills--The student will be able to:	
01.01	Perform pass down communications.	
01.02	Write technical reports.	
01.03	Demonstrate proper logbook recordings.	
01.04	Illustrate reports with graphs, diagrams and charts.	
01.05	Demonstrate training communication skills.	
01.06	Deliver oral reports to groups.	
01.07	Read and follow flow charts.	
02.0	Demonstrate basic mathematics skills--The student will be able to:	
02.01	Solve problems for volume, weight, area, circumference and perimeter measurements for common shapes.	
02.02	Measure tolerances on horizontal and vertical surfaces in any units.	
02.03	Add, subtract, multiply and divide with fractions, decimals, and integers.	
02.04	Solve simultaneous equations.	
02.05	Solve quadratic equations.	
02.06	Plot linear equations.	
02.07	Perform straight line least squares fit.	
02.08	Solve simple trigonometric equations.	
02.09	Perform conversions between English and metric units of length, area, and volume.	
02.10	Perform logarithmic calculations.	
02.11	Plot logarithmic functions.	
03.0	Use basic computer systems and applications--The student will be able to: 	
03.01	Demonstrate an understanding of a LAN (local area network).	
03.02	Use windows based operating system.	
03.03	Demonstrate an understanding of file structures.	
03.04	Use word processing software to format and generate reports.	
03.05	Use spreadsheets to perform calculations, plot graphs, and analyze data.	
03.06	Send, retrieve and maintain electronic mail.	
03.07	Demonstrate an understanding of computer logic including flowcharting, digital components.	
04.0	Demonstrate a basic understanding of DC electronics and electronic components--The student will be able to:	
04.01	Demonstrate an understanding of how and where solid state devices (transistors, diodes, silicon control rectifiers (SCR), logic devices, and electronic relays are used.	
04.02	Identify the electronic components of a power supply circuit including capacitors, inductors, and transformers.	
04.03	Perform calculations on series and parallel circuits.	
04.04	Use chart recorders, oscilloscopes, voltmeters, ammeters, and ohm meters to perform maintenance on equipment and to trouble shoot equipment problems.	
04.05	Demonstrate an understanding of single and multiphase motors.	
04.06	Understand a voltage divide circuit.	
05.0	Demonstrate a basic understanding and applications of instrumental and controls--The student will be able to:	
05.01	Describe the principles of operation of mass flow controllers, temperature controllers, throttle valve, upstream and downstream pressure control.	
05.02	Describe how different temperature sensors detect (thermocouple, pyrometer).	
05.03	Identify the role of PLC.	
05.04	Identify the components of PLC.	
05.05	Know typical input and output power requirements of control devices and how they interface with PLC.	
05.06	Read pin-out diagram.	
05.07	Convert analog signal to appropriate units.	
05.08	Identify common error types and instrument limitations.	
05.09	Identify insitu monitoring techniques (optical emission, reflectance, deposition monitor, RGA).	
05.10	Understand the concept behind PID control.	
05.11	Understand the need for measuring standards.	
05.12	Perform a calibration on control instruments.	
06.0	Follow safe clean room practices and polices--The student will be able to:	
06.01	Demonstrate proper gowning and degowning routines.	
06.02	Identify different types of personal protection equipment, requirements, and where used.	
06.03	Know the lock out tag out regulations.	
06.04	Know how to read MSDS sheets and where to find necessary information (IDLH, TLV, compatibility, etc).	
06.05	Know different types of warning and safety signs.	
06.06	Know the use of emergency power shut off buttons.	
06.07	Know the hazards associated with the use of lasers, radiations sources, RF generators, wet chemicals, compressed gas cylinders and high voltage sources.	
06.08	Demonstrate safe use and appropriate housekeeping of hand and power tools (heat guns, drummel tools, hand drill, soldering guns, etc).	
06.09	Demonstrate proper wafer handling techniques.	
06.10	Demonstrate the need for contamination control.	
07.0	Demonstrate an understanding of metrology testing and applications--The student will be able to:	
07.01	Know and identify common wafer defects.	
07.02	Demonstrate an understanding of how the following metrology tools work and the data that they provide:	
a.	SEM (scanning electron scope)	
b.	X-ray diffractions	
c.	POLARON (capacitance voltage measurement)	
d.	4-point probe	
e.	Hall effect	
f.	RPL (Rapid Photo Luminescence)	
g.	FTIR (Fourier Transform Infra-Red spec)	
h.	Ellipsometer	
i.	Laser surface profile	
j.	Visual image comparison	
k.	Profilometer	
l.	Atomic force microscope	
08.0	Demonstrate an understanding of vacuum and pneumatic systems and their applications--The student will be able to:	
08.01	Identify and describe pressure gauges and how they work, where used and (baratron, thermocouple, pirani, cold cathode, piezoelectric) principles of operation and ranges of use.	
08.02	Identify and describe vacuum pumps and how they work, where used and (baratron, thermocouple, pirani, cold cathode, piezoelectric).	
08.03	Identify types of vacuums pumps (turbo, cryo, mechanical, rotary vane, dry sroll) and applications.	
08.04	Demonstrate use of a leak detector and techniques for use.	
08.05	Define crossover pressure and why it is important.	
08.06	Verify calibration of gauge.	
08.07	Perform routine maintenance on pumps.	
08.08	Understand the concept of virtual leaks and techniques to minimize.	
08.09	Understand the concept of back streaming and how to minimize.	
08.10	Identify welds and joints (VCR, quick flange, VCO, ISO, conflat, compression fittings, ultratorr).	
08.11	Identify valve types (bellows, diaphragm, gates, isolation, ball), their applications for use, modes of failure, and how they are used.	
09.0	Demonstrate a basic understanding of robotic systems and their applications--The student will be able to:	
09.01	Understand the operation of a stepper motor, servo motor, and encoders.	
09.02	Calibrate position and timing.	
09.03	Identify types of feed-through mechanisms.	
09.04	Identify types of robotic sensors (optical, mechanical, time) and how to use (home, limit, pressure, etc).	
09.05	Program a simple robot movement.	
10.0	Demonstrate an understanding of microelectronic manufacturing process--The student will be able to:	
10.01	Demonstrate an understanding of the following wafer manufacturing processes:	
a.	plasma etch (ECR, HDP, RIE)	
b.	photolithography	
c.	thermal processing (diffusion, oxidation, RTA)	
d.	deposition (APCVD, LPCVD, PECVD, PVD)	
e.	crystal growth (MOCVD, LPE, MBE)	
f.	wet processing	
g.	implant	
h.	polishing (CMP)	
10.02	Create a process flow for a simple device.	
11.0	Demonstrate a basic understanding of quality concepts and systems--The student will be able to:	
11.01	Demonstrate a basic understanding of the role of quality systems in industry.	
11.02	Demonstrate a basic understanding of the quality implementation processes and procedures.	
11.03	Demonstrate teamwork skills including: active listening, leadership skills, team member skills, valuing team members’ inputs, recognition of barriers, sharing duties and responsibilities.	
11.04	Use a problem solving methodology to solve quality improvement (QI) issues.	
11.05	Understand the importance of teamwork in different workplace settings.	
12.0	Demonstrate a basic knowledge of chemistry and physics concepts--The student will be able to:	
12.01	Identify chemical elements from their symbols and placement on periodic table.	
12.02	Describe the basic atomic structure of specific elements.	
12.03	Describe the three basic states of matter.	
12.04	Identify the basic properties of acids, bases, and salts.	
12.05	Identify the basic characteristics of ionic and covalent bonds.	
12.06	Read and interpret simple chemical reactions.	
12.07	Perform gas law calculations.	
12.08	Describe a mole.	
12.09	Solve simple work and energy problems.	
12.10	Solve simple force and pressure problems.	
12.11	Describe magnetism.	
12.12	Describe waves and identify their properties.	
12.13	Describe basic optical components and how they work.	
12.14	Solve simple ohm’s law circuit problems. 	
13.0	Demonstrate an understanding of statistical process control--The student will be able to:	
13.01	Define basic statistical parameters including mean, mode, median, standard deviation, etc).	
13.02	Identify different distributions patterns including normal and skewed distributions.	
13.03	Read and interpret histograms, scatter plots, xbar-range, and control charts.	
13.04	Define control limits and specs limits.	
13.05	Know why industry uses SPC.	
13.06	Define the term process capability.	
14.0	Demonstrate an understanding of material handling and delivery--The student will be able to:	
14.01	Identify the components of a gas delivery systems (cylinders, valves, cabinets, valve manifold box, coax tubing, gas detection sensors, regulators, integrated engineering control for facility.	
14.02	Describe how flow balance systems work including vent run balance, dilution network.	
14.03	Know cylinder change out procedures (cycle purges, venturi, gasket compatibility).	
14.04	Know the importance of component material compatibility system.	
14.05	Know how liquid sources are delivered to processes (hazards, temperature dependence).	
14.06	Identify components of bulk liquid delivery systems to processes (pressurized or pumped delivery, bleedlines, liquid and vapor sensor).	
14.07	Identify different types of scrubbing methods (chemical, charcoal absorption, burnt boxes, water base scrubber) and their applications.	
Additional Information

Laboratory Activities

Laboratory activities are an integral part of this program.  These activities include instruction in the use of safety procedures, tools, equipment, materials, and processes related to these occupations.  Equipment and supplies should be provided to enhance hands-on experiences for students. 

Career and Technical Student Organization (CTSO)

SkillsUSA is the appropriate career and technical student organization for providing leadership training and reinforcing specific career and technical skills.  Career and Technical Student Organizations provide activities for students as an integral part of the instruction offered.  The activities of such organizations are defined as part of the curriculum in accordance with Rule 6A-6.065, F.A.C.

Accommodations

Federal and state legislation requires the provision of accommodations for students with disabilities as identified on the secondary student’s Individual Educational Plan (IEP) or 504 plan or postsecondary student’s accommodations’ plan to meet individual needs and ensure equal access.  Postsecondary students with disabilities must self-identify, present documentation, request accommodations if needed, and develop a plan with their counselor and/or instructors.  Accommodations received in postsecondary education may differ from those received in secondary education.  Accommodations change the way the student is instructed.  Students with disabilities may need accommodations in such areas as instructional methods and materials, assignments and assessments, time demands and schedules, learning environment, assistive technology and special communication systems.  Documentation of the accommodations requested and provided should be maintained in a confidential file.

Articulation

To be transferable statewide between institutions, this program must have been reviewed, and a “transfer value” assigned the curriculum content by the appropriate Statewide Course Numbering System discipline committee.  This does not preclude institutions from developing specific articulation agreements with each other. 

For details on articulation agreements which correlate to programs and industry certifications refer to http://www.fldoe.org/workforce/dwdframe/artic_frame.asp.

Program Length

The AS degree requires the inclusion of a minimum of 15 credits of general education coursework according to SACS, and it must be transferable according to Rule 6A-14.030 (2), F.A.C.  The standard length of this program is sixty-eight credit hours according to Rule 6A-14.030, F.A.C.